Flexible Epoxies
Mereco's flexible epoxies have been specifically designed to provide low stress protection combined with repairability. Also available in electrically and thermally conductive versions. Used for low stress protection of electronic assemblies, components, and devices.
Flexible Epoxy Resin Systems
| Product Designation | Hightlight Description | Mix Ratio B to A |
Mixed Viscosity, CPS | Working Time at 25°C |
Cure Schedules | Hardness Shore A or D |
Conductivity Ohm* CM or BTU |
MSDS | PDB |
|---|---|---|---|---|---|---|---|---|---|
| Mereco 1650 Series | Flexible, Varied Viscosity, Potting |
1:1 | 300 Various | 4 hours | 24 hours at 25°C 2 hours at 65°C |
60A | 1.0 x 10*13 | Mereco 1650 Series | Mereco 1650 Series |
| Mereco 1670 Series | Flexible, Varied Viscosity, Adhesives |
2:1 | 120 Various | 8 minutes (20grams) |
15 min (20 grams) |
75A | 1.0 x 10*14 | Mereco 1670 Series | Mereco 1670 Series |
| Mereco 4501-130 | Flexible, Potting Low Durometer |
1:1 | 750 | 24 hours | 8 hours at 25°C | 31A | 1.0 x 10*14 | Mereco 4501-130 | Mereco 4501-130 |
| Mereco XLN-589 | Flexible, Low Slump, Thermal Conductive |
1:1 | 200,000 | 4 hours | 24 hours at 25°C 2 hours at 65°C |
85A | 3.2 BTU | Mereco XLN-589 | Mereco XLN-589 |
| Mereco CLN-845 | Flexible, Low Slump, Thermal Conductive |
1:1 | 250,000 | 4 hours | 24 hours at 25°C 2 hours at 65°C |
85A | 3.7 BTU | Mereco CLN-845 | Mereco CLN-845 |
| Mereco CLN-658 | Flexible Adhesive, Electrically Conductive |
1:1 | Thixotropic | 2.5 hours | 24 hours at 25°C 2 hours at 65°C |
75A | 0.005 | Mereco CLN-658 | Mereco CLN-658 |