Silicone Products
Mereco silicones replace epoxies and urethanes where high and low temperature extremes are expected and low-stress is required. Used in potting and encapsulating, adhesive bonding, and low-stress protection applications.
Two Component Silicone RTV Systems
| Product Designation | Highlight Description | Mix Ration B to A |
Mixed Viscosity, CPS |
Working Time at 25°C, 100 Gram |
Cure Schedule | Hardness Shore A or D |
Volume Resistivity OHM * CM |
MSDS | PDB |
|---|---|---|---|---|---|---|---|---|---|
| Metasil 5002 | Hi-Temp Potting Encapsulating | 100:0.5 | 32,000 | 2 hours | 24 hours at 25°C | 55A | 2.5 x 1015 | Metasil 5002 | Metasil 5002 |
| Metasil 5023 | Addition Cure Potting/ Moldmaking |
10:1 | 12,000 | 2.5 hours | 2 hours at 25°C 15 minutes at 150°C |
30A | 1.0 x 1015 | Metasil 5023 | Metasil 5023 |
| Metasil 5024T Mod 4 | Thermally Conductive Addition Cure |
1:1 | Thixotropic | 30 minutes | 24 hours at 25°C 2 hours at 65°C |
50+/-5A | 7.0 x 1014 | Metasil 5024T Mod 4 | Metasil 5024T Mod 4 |
| Metasil 5060 | Thermally Conductive for DC/DC Converters |
1:1 | Thixotropic | 30 minutes | 24 hours at 25°C 2 hours at 65°C |
50A | 7.0 x 1014 | Metasil 5060 | Metasil 5060 |
| Metasil 5061 | Masking Compound | 1:1 | Thixotropic | 2.5 hours | 24 hours at 25°C 2 hours at 65°C |
35+/-5A | 7.0 x 1014 | Metasil 5061 | Metasil 5061 |
One Component Silicone RTV Systems
| Product Designation | Highlight Description | Mix Ration B to A |
Mixed Viscosity, CPS | Working Time at 25°C, 100 Gram |
Cure Schedule | Hardness Shore A or D |
Volume Resistivity OHM * CM |
MSDS | PDB |
|---|---|---|---|---|---|---|---|---|---|
| Metasil 5002 | High Performance Adhesive | One Part | Thixotropic | 6 months | 24 hours at 25°C Tack-Free 20 min |
30A | 1.5 x 1012 | Metasil 5002 | Metasil 5002 |